Morse Micro, the global technology leader in Wi-Fi HaLow, today announced that Zilogic Systems has joined its Design Partner Program. The announcement marks the program’s first partner based in India and gives customers further access to engineering, testing, automation, and technical consulting expertise for Wi-Fi HaLow products.
The Design Partner Program connects design houses, system integrators, and developer groups with the silicon, tools, and support needed to bring Wi-Fi HaLow products to market quickly. Zilogic joins as an engineering services partner, providing customers with firmware, system software, and validation expertise built around Morse Micro silicon, from board bring-up through test automation.
The partnership establishes Morse Micro’s first Design Partner presence in India, a market central to global automotive and industrial electronics manufacturing. It also equips Zilogic’s existing engineering practice with a new wireless technology to build around. Customers working with Zilogic on embedded and connected products can now design Wi-Fi HaLow support into those products from the outset.
“Zilogic has been shipping products for some of the largest names in automotive and wireless,” said Michael De Nil, co-founder and CEO of Morse Micro. “We’re excited to welcome Zilogic to the program. That depth of engineering is exactly what customers need to bring Wi-Fi HaLow into the market.”
Founded in 2007 and headquartered in Chennai, India, Zilogic Systems is an embedded engineering firm with more than 200 engineers. For nearly two decades, Zilogic has helped automotive, wireless, and industrial customers adopt and extend open-source platforms, including Linux, OpenWrt, prplOS, and RDK-B.
“We are excited to become Morse Micro’s first design partner in India, for Wi-Fi HaLow, bringing our Wi-Fi and IoT engineering expertise to the global market. With our experience in solving complex challenges in this space, we see an exciting opportunity to extend Wi-Fi into the sub-1 GHz space and enable a broader range of IoT applications. We look forward to combining our strengths with Morse Micro to deliver next-generation Wi-Fi HaLow solutions to operators and other customers worldwide,” said P. Ganesan, Managing Director, Zilogic Systems.
Morse Micro continues to see strong interest from design houses globally since announcing the program at Embedded World in March 2026. Zilogic joins Gateworks, VPI Technology, CA Engineering, Vantron, Byte Lab, and Pace Wireless in the Design Partner Program, bringing long-range, low-power, and reliable wireless performance to industrial IoT, Edge AI applications, smart infrastructure, security, utilities, agriculture, and more.
About Morse Micro
Morse Micro is the global technology leader in Wi-Fi HaLow, advancing IoT and Edge AI connectivity with award-winning technology. Headquartered in Sydney, with offices in the United States, Taiwan, China, India, Japan, and the United Kingdom, Morse Micro is driving the adoption of next-generation long-range, low-power Wi-Fi HaLow solutions. Its first-generation MM6108 and second-generation MM8108 Wi-Fi HaLow chips are designed to enable faster, longer range and lower power Edge AI connectivity.
Morse Micro’s Wi-Fi HaLow technology is gaining global momentum as it enables connected devices to achieve ten times the range and cover 100 times the area of traditional Wi-Fi networks, while offering 1,000x the data rates of traditional LPWAN technologies. This advancement is applicable across a range of Edge AI and IoT applications, including smart homes, industrial automation, and smart cities.
About Zilogic Systems
Zilogic Systems is an embedded engineering company with nearly two decades of experience helping global product companies build reliable, connected, and future-ready embedded products. Zilogic partners with SoC manufacturers, Tier 1 suppliers, OEMs, and ODMs across automotive, wireless networking, and IoT to adopt, customize, and extend open-source embedded platforms, including Linux, Android, OpenWrt, prplOS, RDK-B, FreeRTOS, and Zephyr.
Its engineering capabilities span the product lifecycle, from BSP and firmware development to connectivity, system integration, validation, and test automation. Zilogic engages with customers to accelerate time-to-market, reduce engineering complexity, and build the next generation of intelligent and connected embedded products.
View source version on businesswire.com: https://www.businesswire.com/news/home/20261008519864/en/
Media gallery
